Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
| By: | Yue Ma; Christian Gontrand |
| Publisher: | Taylor & Francis |
| Print ISBN: | 9780367023430 |
| eText ISBN: | 9780429680069 |
| Edition: | 1 |
| Format: | Reflowable |
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